Products

Contact Person : Ms. huang grace
Company Name : Shenzhen ALT Electronics Co., Ltd.
Tel : 86-755-29565381
Fax : 86-755-26583580
Address : Guangdong,shenzhen,Fu-Lin Building,Qiaotou,Baoan District,Fuyong Town
Country/Region : China

alibaba express free frieght for printed circuit board

<< Previous Product

Next Product >>

Product Detailed

Related Categories:Other PCB & PCBA

1.OEM/ODM Assembly 2.Certificate:ROHS,ISO9001:2000,SGS,UL certificate 3.Delivery on time

Welcome to ALT PCB factory:

Main products: MULTILAYER PCB, HDI PCB, FLEX PCB, MCPCB and PCB ASSEMBLY.

We are pleased to be able to offer OEM and ODM services. We provide one-stop service from PCB fabrication, PCB assembly to electronic components sourcing service.

Welcome to sent us RFQ!

Quote requirement:

Gerber file and Bom listDate sheet for components partsClear pics of pcba or pcba sample for usTest method for PCBA

Technical requirement:

Professional surface-mounting and through-hole soldering technologyVarious sizes like 1206, 0805, 0603 components SMT technologyICT (In Circuit Test), FCT (Functional Circuit Test) technologyPCB assembly with UL, CE, FCC, RoHS approvalNitrogen gas reflow soldering technology for SMTHigh standard SMT and solder assembly lineHigh density interconnected board placement technology capacity

Delivery Detail :

sample:Double-layer:1-3 days; Multi-layer:2-5 days

mass:Double-layer:2-7 days; Multi-layer:5-7days

Payment and Delivery Term

Product Description: FPC& Flex PCB, Flex PCB Assembly

Specifications

Item	Manufacture Capability
Material	FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based
Layer No.	1-30 pcb transformers pcb depaneling machine
Finished Board thickness	0.2 mm-3.8mm’(8 mil-150 mil)

Board Thickness Tolerance	±10%
Cooper thickness	0.5 OZ-11OZ (18 um-385 um)
Copper Plating Hole	18-40 um
Impedance Control	±10%
Warp&Twist	0.70%
Peelable	0.012"(0.3mm)-0.02’(0.5mm)
Images
Min Trace Width (a)	0.075mm (3mil)
Min Space Width (b)	0.1mm (4 mil)
Min Annular Ring	0.1mm (4 mil)
SMD Pitch (a)	0.2 mm(8 mil)
BGA Pitch (b)	0.2 mm (8 mil)
	0.05mm
Solder Mask
Min Solder Mask Dam (a)	0.0635 mm (2.5mil)
Soldermask Clearance (b)	0.1mm (4 mil)
Min SMT Pad spacing (c)	0.1mm (4 mil)
Solder Mask Thickness	0.0007"(0.018mm)
Holes
Min Hole size (CNC)	0.2 mm (8 mil)
Min Punch Hole Size	0.9 mm (35 mil)
Hole Size Tol (+/-)	PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol	±0.075mm
Plating
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-5u''
OSP	0.2-0.5um
Outline
Panel Outline Tol (+/-)	CNC: ±0.125mm, Punching: ±0.15mm
Beveling	30°45°
Gold Finger angle	15° 30° 45° 60°
Certificate	ROHS, ISO9001:2000, SGS, UL certificate